Founders

Michael R. Arneson
Michael R. ArnesonCEO & Co-foundermrarneson@matrics2.com

Mr. Arneson is the CEO & Co-founder of Matrics2, as well as, the Co-founder of both Matrics and Innurvation, with over 30 years of experience in extensive microelectronics design, RFID design, and manufacturing experience. Mr. Arneson has received several awards to include the Ernst & Young Entrepreneur of the Year in 2004. Mr. Arneson has twice won the IEEE’s best paper of the year award in advanced packaging, as well as, has received the NSA Distinguished Service Award during his time of employment. In addition to his awards he is also the Co-founder and CEO of his Non-Profit called Harvest Seed International Foundation (HSIF) A 501(c)(3) whose sole mission is to aid and feed starving children in third world countries.

Full Resume

William R Bandy PhD
William R Bandy PhDChief Scientist / Co-founderwrbandy@matrics2.com

Dr. Bandy was a Co-founder of Matrics, Innurvation, and is a Co-founder of Matrics2. In addition to his extensive microelectronics and RFID design and manufacturing experience, Dr. Bandy received several many awards including the ERNST & YOUNG Entrepreneur of the Year 2004 Finalist, the NSA Distinguished Service Award, and the University of Maryland Department of Physics Distinguished Alumnus Award in 2012.

Full Resume

Matrics2: Contact Us

Who We Are:
Original Matrics2 founders sold to Symbol for $230M. They have a total of 54 years at NSA, most of those years are in manufacturing experience especially in microelectronics, Radio Frequency Identification (RFID), pressure sensitive labels, as well as a total of 50 years’ experience in start-ups. We invented, engineered, designed, developed, and ran the first Parallel Integrated Circuit assembly (PICA) system in the world for high volume low-cost RFID tag assembly. In addition to that, our executive VP of Manufacturing has over 24 years in design, manufacturing and management, within the fields of chip attachment, compounding, coating, finishing, pressure-sensitive, retro reflective signage, reverse roll wide web hot melt adhesive, laminating, and aluminum UHF RFID antennas.